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SF701
Characteristic
● Low dielectric constant, lowdissipation loss.
● Excellent soldering reliability,dimensionalstability,chemical resistance andelectrical properties.
● Halogen-free, flammabilityUL94 VTM-0.
● Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr6+,PBB,PBDE,etc..
Application Area
Smart phone antenna, Microwave communication,high speed network equipment, sensor, highfrequency PCB, etc..- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength(90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.0 |
| 288℃、5s | 1.0 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃、10s | - | No delamination |
| Dimensional Stability | IPC-TM-650 2.2.4B | After Etched | % | -0.0391/-0.0512 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % | 97 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 159 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 1.5×109 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ | 5.8×105 |
| Dielectric Constant(10GHz) | SPDR | C-24/23/50 | - | 2.9 |
| Dissipation Factor(10GHz) | SPDR | C-24/23/50 | - | 0.002 |
| Folding Endurance | JIS C-6471 | R0.8×4.9N | Times | ＞400 |
| Flammability | UL94 | E-24/125 | Rating | VTM-0 |
Remarks:
1.Certified to IPC-4204/24 Copper Clad Liquid CrystalPolymer Adhesiveless
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.