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Smart Terminal
Rigid Materials
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IMS and HTC materials
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- Environmental Material
- Extremely low-loss
- 環(huán)保材料
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
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- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
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- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
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- IC Substrate Materials
- IMS and HTC materials
- Special Materials
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- 不流動P片
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- 超低介質損耗
- 低介質損耗
- 疊層母排用絕緣膠膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 熱固性樹脂體系
- 硬質聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質損耗
- 鋁基板
- 銅基板
- 撓性覆銅板
- 覆蓋膜
- 膠膜
- 補強板
- 常規(guī)FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- IC Substrate
- 涂樹脂銅箔
- 碳氫系列產品
- 導熱FR-4.0
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- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
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- 江蘇生益
- 江西生益
- 香港生益
- 臺灣生益
- 臺灣
- PTFE Type
- 熱固性樹脂體系
- 硬質聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質損耗
- 低介質損耗
- 超低介質損耗
- 撓性覆銅板
- 覆蓋膜
- 不流動P片
- 膠膜
- 補強板
- 疊層母排用絕緣膠膜
- 東莞
- 蘇州
- 咸陽
- 韓國
- 歐洲
- 美國中北大道
- 美國森林大道
- 日本
- 東莞萬江
- 咸陽
- 蘇州
- 常熟
- 南通
- 九江
- 東南亞
- 巴西
- 常規(guī)FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- 涂樹脂銅箔
- 碳氫系列產品
- 鋁基板
- 銅基板
- 導熱FR-4.0
- 其它
- UL檔案
- UL認證（查詢）
- CQC認證
- BSI認證
- JET認證
- VDE認證
- 三會規(guī)則
- 工作制度
- 內部控制
- 研發(fā)及工程化對外業(yè)務
- 委托測試對外業(yè)務
- 知識產權和標準對外業(yè)務
- 人才培養(yǎng)和技術培訓
- 聯(lián)系方式
- 汽車產品
- Environmental Material
- Extremely low-loss
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
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- Df/10GHz
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