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Smart Terminal
Rigid Materials
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- 環(huán)保材料
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- Smart Terminal
- IC Substrate
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- Thermal Conductive CEM-3
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- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
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- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- 不流動P片
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- 超低介質(zhì)損耗
- 低介質(zhì)損耗
- 疊層母排用絕緣膠膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 熱固性樹脂體系
- 硬質(zhì)聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質(zhì)損耗
- 鋁基板
- 銅基板
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- 補強板
- 常規(guī)FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- IC Substrate
- 涂樹脂銅箔
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- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
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- 江西生益
- 香港生益
- 臺灣生益
- 臺灣
- PTFE Type
- 熱固性樹脂體系
- 硬質(zhì)聚酰亞胺材料
- 半撓性材料
- 特種粘合材料
- 中等介質(zhì)損耗
- 低介質(zhì)損耗
- 超低介質(zhì)損耗
- 撓性覆銅板
- 覆蓋膜
- 不流動P片
- 膠膜
- 補強板
- 疊層母排用絕緣膠膜
- 東莞
- 蘇州
- 咸陽
- 韓國
- 歐洲
- 美國中北大道
- 美國森林大道
- 日本
- 東莞萬江
- 咸陽
- 蘇州
- 常熟
- 南通
- 九江
- 東南亞
- 巴西
- 常規(guī)FR-4.0
- 無鉛兼容FR-4.0, FR-15.0
- 無鹵無鉛兼容FR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- 涂樹脂銅箔
- 碳氫系列產(chǎn)品
- 鋁基板
- 銅基板
- 導熱FR-4.0
- 其它
- UL檔案
- UL認證（查詢）
- CQC認證
- BSI認證
- JET認證
- VDE認證
- 三會規(guī)則
- 工作制度
- 內(nèi)部控制
- 研發(fā)及工程化對外業(yè)務(wù)
- 委托測試對外業(yè)務(wù)
- 知識產(chǎn)權(quán)和標準對外業(yè)務(wù)
- 人才培養(yǎng)和技術(shù)培訓
- 聯(lián)系方式
- 汽車產(chǎn)品
- Environmental Material
- Extremely low-loss
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- S1150G
- (ULANSI:FR-4.1)High Performance ,Mid –Tg Halogen-free
- --
- --
- 0.011
- 4.7
- --
- --
- --
- --
- --
- BIF201
- Halogen-free white insulation bonding sheet for PET laminated busbar
- --
- --
- 0.02
- 3.5
- --
- --
- --
- 135
- 310
- BIF202
- Halogen-free insulation bonding sheet for PET laminated busbar
- --
- --
- 0.02
- 3.5
- --
- --
- 3.50%
- 135
- 310
- S7045G
- Mid-loss, HFR-free, FR4.1 Multilayer Used PCB Base Material
- --
- --
- --
- --
- 4.30
- 0.010
- --
- --
- --
- SML02G
- High Tg, Low CTE, Mid-Loss Multilayer Material
- --
- --
- --
- --
- 4.24
- 0.0069
- 1.1%
- 175
- 410
- S7045GH
- Halogen-free, High Reliability & Mid Loss Material
- --
- --
- --
- --
- 3.95
- 0.0095
- --
- --
- --
- S7040G
- Mid-loss, HFR-free Multilayer PCB Used Base Material
- --
- --
- --
- --
- 3.72
- 0.0089
- --
- --
- --
- S7439C
- Low-loss HSD PCB Used Multilayer Base Material
- --
- --
- --
- --
- 3.66
- 0.0060
- --
- --
- --
- S7439
- Low-loss HSD PCB Used Multilayer PCB Material
- --
- --
- --
- --
- 3.66
- 0.0060
- --
- --
- --
- S7439G
- Low-loss, HFR-free, HSD PCB Used Multilayer Base Material
- --
- --
- --
- --
- 3.74
- 0.0060
- --
- --
- --